PCB Heat Sinks Market
The heat sink is a cooling method that transfers dissipated heat from PCB components into a cooli ... Read More
BGA heat sinks are named as such because they are mounted to BGA devices, but are actually just simple extrusions. BGA heat sinks are usually crosscut to convert the extruded fins into pins which allow them to be used in more diverse applications.
This report contains market size and forecasts of BGA Heat Sinks in global, including the following market information:
Global BGA Heat Sinks Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global BGA Heat Sinks Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five BGA Heat Sinks companies in 2021 (%)
The global BGA Heat Sinks market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Aluminum Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of BGA Heat Sinks include Boyd, Wakefield Thermal, Advanced Thermal Solutions, Ohmite, Trenz Electronic, CTS Corporation, CUI Devices, TE Connectivity and Cooliance, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the BGA Heat Sinks manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global BGA Heat Sinks Market, by Material, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global BGA Heat Sinks Market Segment Percentages, by Material, 2021 (%)
Aluminum
Copper
Others
Global BGA Heat Sinks Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global BGA Heat Sinks Market Segment Percentages, by Application, 2021 (%)
Motherboards
Video Cards
Others
Global BGA Heat Sinks Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global BGA Heat Sinks Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies BGA Heat Sinks revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies BGA Heat Sinks revenues share in global market, 2021 (%)
Key companies BGA Heat Sinks sales in global market, 2017-2022 (Estimated), (K Units)
Key companies BGA Heat Sinks sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Boyd
Wakefield Thermal
Advanced Thermal Solutions
Ohmite
Trenz Electronic
CTS Corporation
CUI Devices
TE Connectivity
Cooliance
Magntek Electronic
COFAN USA
Broadlake
Suzhou Xunchuan Electronics
Shenzhen Lori Technology
The heat sink is a cooling method that transfers dissipated heat from PCB components into a cooli ... Read More
Silicone-free thermal grease is a non-silicon paste compound of thermal interface material that d ... Read More
In a typical power electronics package, a grease layer forms the interface between the direct bon ... Read More
Copper Sulfide powder is available as a 99.99 pure (metals basis) black powder in batch quantitie ... Read More