The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2017 to 2028. by Application segment also provides consumption during the forecast period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
Electrically Conductive
Thermally Conductive
UV Curing
Others
Segment by Application
Printed Circuit Board
Semiconductor & IC
Others
By Company
BASF SE
Covestro
3M Company
Bostik Sa
Avery Dennison Corporation
Dow Chemical Company
Royal Adhesives and Sealants
Sika Ag
Ashland Inc.
ITW Performance Polymers (Illinois Tool Works Inc.)
H.B. Fuller Company
RPM International Inc.
Adhesives Research Inc.
Beardow & Adams (Adhesives) Ltd.
Chemence Inc.
Henkel
Huntsman Corporation
Pidilite Industries
Mapei Spa
Super Glue Corporation
Heng Ying Adhesive Co., Ltd.
Ninghai Dingcheng Adhesive Co., Ltd.
American Biltrite, Inc.
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina