FC-BGA substrates are high-density semiconductor packaging substrates that enable high speed and multi-functionality of LSI chips. The product is a package substrate that is used for the core semiconductors of mobile devices and PCs. It transmits electric signals between semiconductors and the main board, and protects expensive semiconductors from external stress. Compared with general substrates, as this substrate is a high-density circuit substrate containing more microcircuits, the assembly defects and incurred costs in directly bonding expensive semiconductors to the substrate can be reduced.

Market Analysis and Insights: Global Flip Chip Ball Grid Array (FCBGA) Market
The global Flip Chip Ball Grid Array (FCBGA) market is valued at US$ million in 2020. The market size will reach US$ million by the end of 2027, growing at a CAGR of % during 2021-2027.

Global Flip Chip Ball Grid Array (FCBGA) Scope and Segment
Flip Chip Ball Grid Array (FCBGA) market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Flip Chip Ball Grid Array (FCBGA) market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2016-2027.

Segment by Type
Below 8 Layer
8-20 Layer
Others

Segment by Application
CPU
ASIC
GPU
Others

By Company
Unimicron
Ibiden
Samsung Electro-Mechanics
Amkor Technology
Fujitsu
TOPPAN INC
Shinko Electric
Nan Ya PCB Corporation
AT＆S
Daeduck Electronics
Kinsus Interconnect Technology
Zdtco
KYOCERA
NCAP China

Production by Region
North America
Europe
China
Japan
South Korea

Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE