As the global economy mends, the 2021 growth of High Density Interconnect (HDI) PCBs will have significant change from previous year. According to our (LP Information) latest study, the global High Density Interconnect (HDI) PCBs market size is USD million in 2022 from USD 12910 million in 2021, with a change of % between 2021 and 2022. The global High Density Interconnect (HDI) PCBs market size will reach USD 25870 million in 2028, growing at a CAGR of 10.4% over the analysis period.
The United States High Density Interconnect (HDI) PCBs market is expected at value of US$ million in 2021 and grow at approximately % CAGR during review period. China constitutes a % market for the global High Density Interconnect (HDI) PCBs market, reaching US$ million by the year 2028. As for the Europe High Density Interconnect (HDI) PCBs landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 5-year period.
Global main High Density Interconnect (HDI) PCBs players cover IBIDEN Group, NCAB Group, Bittele Electronics, and TTM Technologies, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of High Density Interconnect (HDI) PCBs market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
4-6 Layers HDI PCBs
8-10 Layer HDI PCBs
10+ Layer HDI PCBs
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
Automotive
Computers
Communication
Digital
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
IBIDEN Group
NCAB Group
Bittele Electronics
TTM Technologies
Unimicron
AT&S
SEMCO
Young Poong Group
ZDT
Unitech Printed Circuit Board
LG Innotek
Tripod Technology
Daeduck
HannStar Board
Nan Ya PCB
CMK Corporation
Kingboard
Ellington
Wuzhu Technology
Kinwong
Aoshikang
Sierra Circuits
Epec
Wurth Elektronik
NOD Electronics