This report contains market size and forecasts of Microelectronic Automatic Wire Bonding Systems in Global, including the following market information:
Global Microelectronic Automatic Wire Bonding Systems Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Microelectronic Automatic Wire Bonding Systems market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Semi-Automatic Bonding Systems Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Microelectronic Automatic Wire Bonding Systems include Kulicke & Soffa (K&S), ASM Pacific Technology, Shinkawa, KAIJO, Hesse, F&K, Ultrasonic Engineering, Micro Point Pro(MPP) and Applied Materials, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Microelectronic Automatic Wire Bonding Systems companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Microelectronic Automatic Wire Bonding Systems Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Microelectronic Automatic Wire Bonding Systems Market Segment Percentages, by Type, 2021 (%)
Semi-Automatic Bonding Systems
Fully Automatic Bonding Systems
Global Microelectronic Automatic Wire Bonding Systems Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Microelectronic Automatic Wire Bonding Systems Market Segment Percentages, by Application, 2021 (%)
Sensors
Actuators
Switches
Other
Global Microelectronic Automatic Wire Bonding Systems Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Microelectronic Automatic Wire Bonding Systems Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Microelectronic Automatic Wire Bonding Systems revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Microelectronic Automatic Wire Bonding Systems revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Kulicke & Soffa (K&S)
ASM Pacific Technology
Shinkawa
KAIJO
Hesse
F&K
Ultrasonic Engineering
Micro Point Pro(MPP)
Applied Materials
Palomar Technologies
BE Semiconductor Industries
FandK Delvotec Bondtechnik GmbH
DIAS Automation
West Bond