Semiconductor Devices for High Temperature have long been used in aerospace, oil and gas operations. Only when a high temperature device is used as a driving device of a silicon carbide switch, its high temperature resistance characteristics can be brought into play, which can reduce or even eliminate the need for a cooling system. It has the effect of slowing down the aging of the device and increasing the working life.
This report contains market size and forecasts of Semiconductor Devices for High Temperature in global, including the following market information:
Global Semiconductor Devices for High Temperature Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Semiconductor Devices for High Temperature Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Semiconductor Devices for High Temperature companies in 2021 (%)
The global Semiconductor Devices for High Temperature market was valued at 6932.1 million in 2021 and is projected to reach US$ 19680 million by 2028, at a CAGR of 16.1% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Gallium Nitride (GaN) Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Devices for High Temperature include Cree Inc., Fujitsu Ltd., Gan Systems Inc., General Electric, GeneSiC Semiconductor, Infineon Technologies, NXP Semiconductors, Qorvo and Renesas Electronics, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Semiconductor Devices for High Temperature manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Devices for High Temperature Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Semiconductor Devices for High Temperature Market Segment Percentages, by Type, 2021 (%)
Gallium Nitride (GaN)
Silicon Carbide (SiC)
Gallium Arsenide (GaAs)
Diamond Semiconductor
Global Semiconductor Devices for High Temperature Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Semiconductor Devices for High Temperature Market Segment Percentages, by Application, 2021 (%)
Defense & Aerospace
Information & Communication Technology
Healthcare
Steel & Energy
Electronics & Electrical
Others
Global Semiconductor Devices for High Temperature Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Semiconductor Devices for High Temperature Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Devices for High Temperature revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Semiconductor Devices for High Temperature revenues share in global market, 2021 (%)
Key companies Semiconductor Devices for High Temperature sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Semiconductor Devices for High Temperature sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Cree Inc.
Fujitsu Ltd.
Gan Systems Inc.
General Electric
GeneSiC Semiconductor
Infineon Technologies
NXP Semiconductors
Qorvo
Renesas Electronics
Texas Instruments
Toshiba
Allegro Microsystems Llc
SMART Modular Technologies