The global TCB Bonder market was valued at 32.15 Million USD in 2021 and will grow with a CAGR of 20.24% from 2021 to 2027, based on HNY Research newly published report.

The prime objective of this report is to provide the insights on the post COVID-19 impact which will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).

Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global TCB Bonder market is driven by increased TCB Bonder usage: memory applications currently, logic devices next. Meanwhile, TCB Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology. The leading enterprises in the TCB Bonder market are ASMPT (AMICRA) (HK) and K&S (US), which followed by Besi (NL), Shibaura (JP), SET (FR), and Hanmi (KR). These Top companies currently account for more than 91.03% of the total market share and are expected to retain their dominating hold over the market during the forecast period. North America TCB Bonder market would keep being the largest market, followed by Europe in 2018. Japan market and China market would rank forth (12 units) and fifth (11 units).

By Market Verdors:

ASMPT (Amicra)

K&S

BESI

Shibaura

SET

Hamni

By Types:

Automatic TCB Bonder

Manual TCB Bonder

By Applications:

IDMs

OSAT

Key Indicators Analysed

Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.

Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.

Market Trends: Market key trends which include Increased Competition and Continuous Innovations.

Opportunities and Drivers: Identifying the Growing Demands and New Technology

Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

Key Reasons to Purchase

To gain insightful analyses of the market and have comprehensive understanding of the global market and its commercial landscape.

Assess the production processes, major issues, and solutions to mitigate the development risk.

To understand the most affecting driving and restraining forces in the market and its impact in the global market.

Learn about the market strategies that are being adopted by leading respective organizations.

To understand the future outlook and prospects for the market.

Besides the standard structure reports, we also provide custom research according to specific requirements.