In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat sink. This grease layer has the highest thermal resistance of any layer in the package.
This report contains market size and forecasts of Thermal Interface Materials for Power Electronics in global, including the following market information:
Global Thermal Interface Materials for Power Electronics Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Thermal Interface Materials for Power Electronics Market Sales, 2017-2022, 2023-2028, (Tons)
Global top five Thermal Interface Materials for Power Electronics companies in 2021 (%)
The global Thermal Interface Materials for Power Electronics market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Silicone-based Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Thermal Interface Materials for Power Electronics include Dupont, Shin-Etsu, Panasonic, Laird, Henkel, Honeywell, 3M, Semikron and Momentive, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Thermal Interface Materials for Power Electronics manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thermal Interface Materials for Power Electronics Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Thermal Interface Materials for Power Electronics Market Segment Percentages, by Type, 2021 (%)
Silicone-based
Non-silicone
Global Thermal Interface Materials for Power Electronics Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Thermal Interface Materials for Power Electronics Market Segment Percentages, by Application, 2021 (%)
CPU
GPU
Memory Module
Others
Global Thermal Interface Materials for Power Electronics Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Thermal Interface Materials for Power Electronics Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Thermal Interface Materials for Power Electronics revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Thermal Interface Materials for Power Electronics revenues share in global market, 2021 (%)
Key companies Thermal Interface Materials for Power Electronics sales in global market, 2017-2022 (Estimated), (Tons)
Key companies Thermal Interface Materials for Power Electronics sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Dupont
Shin-Etsu
Panasonic
Laird
Henkel
Honeywell
3M
Semikron
Momentive
Roger
AI Technology
Fujipoly
Parker
Shenzhen HFC