CSP/BGA Board Level Underfill is used for filling and sealing spaces by capillary action when doing secondary mounting of Packaged Chips to a Motherboard. CSP/BGA Board Level Underfill material improves thermal cycle performance and enhances impact resistance (drop-test qualification).
This report contains market size and forecasts of Underfills for CSP and BGA in global, including the following market information:
Global Underfills for CSP and BGA Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Underfills for CSP and BGA Market Sales, 2017-2022, 2023-2028, (Tons)
Global top five Underfills for CSP and BGA companies in 2021 (%)
The global Underfills for CSP and BGA market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Low Viscosity Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Underfills for CSP and BGA include Namics, Henkel, ThreeBond, Won Chemical, AIM Solder, Fuji Chemical, Shenzhen Laucal Advanced Material, Dongguan Hanstars and Hengchuang Material. etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Underfills for CSP and BGA manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Underfills for CSP and BGA Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Underfills for CSP and BGA Market Segment Percentages, by Type, 2021 (%)
Low Viscosity
High Viscosity
Global Underfills for CSP and BGA Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Underfills for CSP and BGA Market Segment Percentages, by Application, 2021 (%)
CSP
BGA
Global Underfills for CSP and BGA Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Underfills for CSP and BGA Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Underfills for CSP and BGA revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Underfills for CSP and BGA revenues share in global market, 2021 (%)
Key companies Underfills for CSP and BGA sales in global market, 2017-2022 (Estimated), (Tons)
Key companies Underfills for CSP and BGA sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Namics
Henkel
ThreeBond
Won Chemical
AIM Solder
Fuji Chemical
Shenzhen Laucal Advanced Material
Dongguan Hanstars
Hengchuang Material